應屆畢業生
本科
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職位描述
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RESPONSIBILITIES:
? Construct the product system architecture with the ability to make interdisciplinary trade-offs to optimize for the best cost/performance/time.
? Responsible for headset electrical detailed design (including test and debug) with cross-function team and ODM supplier, conduct design review before design release for production tooling
? Define product requirements and specifications (mechanical, electrical, acoustic, firmware) and test document as necessary to ensure desired quality and performance of the product
? Building an efficient communication bridge to ODM supplier with worldwide development teams across multiple disciplines (Product Manager, QA, Ops, 3rd party supplier etc.)
? Provide global technical support to other non-engineering functions on key technologies and past, present, and future products
? Develop new technologies/technology platforms
REQUIREMENTS
? 6 years experience in product development of electronic products, 2 years experience as a lead of ODM projects is a must.
? Bachelor degree in electrical engineering discipline or similar.
? Strong consumer electronic industrial background. Wireless and audio working experience will be a plus.
? Rich design experience for high volume manufacture of consumer electronic product.
? EDA experience in validating schematic and PCB/A layout, prototype bring-up and debugging between Engineering team and ODM, lead team to meet requirement of EMC/EMI, ESD, RF, reliability etc.
? Thorough understanding of, and ability to clearly explain, EE concepts such as A/D, DC/DC supply, RF gain compression, EMI noise suppression techniques, SWR and power measurement
? Strong electrical engineering background with clear understanding of software/firmware development. Track record of learning and understanding other engineering disciplines (software, firmware, mechanical, acoustic)
? Broad exposure to many engineering disciplines: Electrical, Mechanical, Software, Systems, Acoustics
? Strong written and oral communication skills in both English and Mandarin, and strong interpersonal skills
? Ability to work with others in a widely-disbursed, fast-paced team environment
? Excellent time management and organizational skills
HIGHLY DISIRERABLE
? Experience/knowledge of RF design and antenna design for wireless systems
? Experience /knowledge of embedded system design and coding
? Experience working with global engineering team and product management to define products and make tradeoffs
? Experience mentoring junior engineers for technical skills and soft skills
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工作地點
地址：蘇州吳中區蘇州-工業園區繽特力通訊科技公司
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職位發布者
HR
中國惠普有限公司
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計算機硬件·網絡設備
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1000人以上
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中外合資（合資·合作）
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朝陽區建國路112號中國惠普大廈
